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Objective: The purpose of this study was to investigate the effect of different adhesives on shear bond strength of bonding between Polyetheretherketone and resin composite
Material and methods: Thirty nine specimens of Polyetheretherketone were prepared by Isomet (5×5×2 mm3), and were embedded in a metal ring with an auto-polymerized acrylic resin. All specimens were polished with P400 P800 P1200 and P2000 grit sand papers. Three specimens were randomly selected to investigate surface roughness before and after sandblasting with 110 µm alumina particles at atmospheric pressure of 4 bars for 15 seconds. The rest of the specimens were sandblasted, as previously described, then were randomly divided into 4 groups (n=9) according to the adhesives application: Control (no adhesive applied), Helibond, Clearfil SE bond and AQ Bond plus. Three specimens in each group were subjected to contact angle measurement with de-ionized water. Six specimens were bonded to resin composite and subjected to shear bond strength testing in a universal testing machine. The surface roughness data were analyzed with paired sample T-test, the contact angle and the shear bond strength were analyzed with One-way ANOVA and Scheffe multiple comparisons with significant set at p = 0.05.
Result: Clearfil SE bond group revealed the highest shear bond strength (31.24 ± (1.63) MPa). There was no significant difference in shear bond strength between Clearfil SE bond group and AQ bond plus group (28.44 ± (2.60) MPa), but there were statistically significant differences compared to that of Heliobond group (24.96 ± (3.77) MPa) and Control group (23.04 ± (3.11) MPa). The surface
roughness before sandblasting was significantly lower than that of specimens after sandblasting. The contact angle of AQ Bond plus group had the least value (22.85 ± (2.89) degrees), and Control group was significantly higher than the other groups (140.42±(6.04 (degrees)
Conclusions: The highest shear bond strength was achieved by application of Clearfil SE bond after sandblasting with 110 µm alumina particles.